Advanced Packaging Market Size, Share, Growth and Forecast to 2022-27

The latest research study ” Advanced Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2022-2027” offers a comprehensive analysis of the industry, which comprises insights on global advanced packaging market Share. The global advanced packaging market size reached US$ 32.53 Billion in 2021. Looking forward, IMARC Group expects the market to reach US$ 67.04 Billion by 2027, exhibiting a growth rate (CAGR) of 11.60% during 2022-2027.

Advanced packaging refers to the interconnection and aggregation of components that enclose metallic parts and numerous devices, including wafers, logic units, and memory, to protect them from physical damage and corrosion during the final procedure of semiconductor manufacturing. It includes 2.5D, 3D-IC, system-in, and fan-out-wafer-level-package as a combination of several techniques. Advanced packaging methods are implemented after determining various parameters, such as power consumption, operating conditions, measurable size, costs, etc. It increases the functionality of numerous electronic devices, ensures lower power consumption, provides better chip connectivity, and shields silicon chips from mechanical stresses or vibrations. As a result, advanced packaging is extensively utilized in several electronic gadgets and devices.

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Note: We are regularly tracking the direct effect of COVID-19 on the market, along with the indirect influence of associated industries. These observations will be integrated into the report.

Report Coverage:

Advanced Packaging Market Trends and Drivers:

The expanding applications of packaging in the electronics sector and the increasing demand for various consumer electronics, including wearables, desktops, smartphones, laptops, miniaturized devices, etc., are among the key factors augmenting the advanced packaging market. Furthermore, the escalating utilization of packaging solutions by manufacturers to accomplish delicate patterning in wafers by reducing integrated circuit (IC) sizes in semiconductors is acting as another significant growth-inducing factor. Moreover, the widespread adoption of nano-sized robotic surgery equipment and sophisticated wearable devices is encouraging leading companies to rely on advanced packaging techniques over conventional procedures to promote system optimization, which is also bolstering the market growth. Apart from this, the elevating inclination towards fan-out wafer-level packaging, owing to its numerous benefits, such as superior thermal performance, increased wafer-level yield, easier packaging system, and the acceptance of three-dimensional (3D) circuits, is expected to positively influence the advanced packaging market in the coming years.

Advanced Packaging Market 2022-2027 Analysis and Segmentation:

Competitive Landscape:

The competitive landscape of the market has been studied in the report with the detailed profiles of the key players operating in the market.

Advanced Semiconductor Engineering Inc., Amkor Technology Inc., Analog Devices Inc., Brewer Science, ChipMOS Technologies Inc., Microchip Technology Inc., Powertech Technology Inc., Samsung Electronics Co. Ltd, SÜSS MicroTec SE, Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated and Universal Instruments Corporation (CBA Group Inc.).

The report has segmented the market on the basis of type and end use.

Type:

• Flip-Chip Ball Grid Array
• Flip Chip CSP
• Wafer Level CSP
• 5D/3D
• Fan Out WLP
• Others

Use:

• Consumer Electronics
• Automotive
• Industrial
• Healthcare

End

• Aerospace and Defense
• Others

Region:

• North America: (United States, Canada)
• Asia Pacific: (China, Japan, India, South Korea, Australia, Indonesia, Others)
• Europe: (Germany, France, United Kingdom, Italy, Spain, Russia, Others)
• Latin America: (Brazil, Mexico, Others)
• Middle East and Africa

Key highlights of the report:

• Market Performance (2016-2021)
• Market Outlook (2022- 2027)
• Porter’s Five Forces Analysis
• Market Drivers and Success Factors
• SWOT Analysis
• Value Chain
• Comprehensive Mapping of the Competitive Landscape

1    Preface
2    Scope and Methodology
2.1    Objectives of the Study
2.2    Stakeholders
2.3    Data Sources
2.3.1    Primary Sources
2.3.2    Secondary Sources
2.4    Market Estimation
2.4.1    Bottom-Up Approach
2.4.2    Top-Down Approach
2.5    Forecasting Methodology
3    Executive Summary
4    Introduction
4.1    Overview
4.2    Key Industry Trends
5    Global Advanced Packaging Market
5.1    Market Overview
5.2    Market Performance
5.3    Impact of COVID-19
5.4    Market Forecast
6    Market Breakup by Type
6.1    Flip-Chip Ball Grid Array
6.1.1 Market Trends
6.1.2 Market Forecast
6.2    Flip Chip CSP
6.2.1 Market Trends
6.2.2 Market Forecast
6.3    Wafer Level CSP
6.3.1 Market Trends
6.3.2 Market Forecast
6.4    5D/3D
6.4.1 Market Trends
6.4.2 Market Forecast
6.5    Fan Out WLP
6.5.1 Market Trends
6.5.2 Market Forecast
6.6    Others
6.6.1 Market Trends
6.6.2 Market Forecast
7    Market Breakup by End Use
7.1    Consumer Electronics
7.1.1 Market Trends
7.1.2 Market Forecast
7.2    Automotive
7.2.1 Market Trends
7.2.2 Market Forecast
7.3    Industrial
7.3.1 Market Trends
7.3.2 Market Forecast
7.4    Healthcare
7.4.1 Market Trends
7.4.2 Market Forecast
7.5    Aerospace and Defense
7.5.1 Market Trends
7.5.2 Market Forecast
7.6    Others
7.6.1 Market Trends
7.6.2 Market Forecast
8    Market Breakup by Region
8.1    North America
8.1.1 United States
8.1.1.1 Market Trends
8.1.1.2 Market Forecast
8.1.2 Canada
8.1.2.1 Market Trends
8.1.2.2 Market Forecast
8.2    Asia-Pacific
8.2.1 China
8.2.1.1 Market Trends
8.2.1.2 Market Forecast
8.2.2 Japan
8.2.2.1 Market Trends
8.2.2.2 Market Forecast
8.2.3 India
8.2.3.1 Market Trends
8.2.3.2 Market Forecast
8.2.4 South Korea
8.2.4.1 Market Trends
8.2.4.2 Market Forecast
8.2.5 Australia
8.2.5.1 Market Trends
8.2.5.2 Market Forecast
8.2.6 Indonesia
8.2.6.1 Market Trends
8.2.6.2 Market Forecast
8.2.7 Others
8.2.7.1 Market Trends
8.2.7.2 Market Forecast
8.3    Europe
8.3.1 Germany
8.3.1.1 Market Trends
8.3.1.2 Market Forecast
8.3.2 France
8.3.2.1 Market Trends
8.3.2.2 Market Forecast
8.3.3 United Kingdom
8.3.3.1 Market Trends
8.3.3.2 Market Forecast
8.3.4 Italy
8.3.4.1 Market Trends
8.3.4.2 Market Forecast
8.3.5 Spain
8.3.5.1 Market Trends
8.3.5.2 Market Forecast
8.3.6 Russia
8.3.6.1 Market Trends
8.3.6.2 Market Forecast
8.3.7 Others
8.3.7.1 Market Trends
8.3.7.2 Market Forecast
8.4    Latin America
8.4.1 Brazil
8.4.1.1 Market Trends
8.4.1.2 Market Forecast
8.4.2 Mexico
8.4.2.1 Market Trends
8.4.2.2 Market Forecast
8.4.3 Others
8.4.3.1 Market Trends
8.4.3.2 Market Forecast
8.5    Middle East and Africa
8.5.1 Market Trends
8.5.2 Market Breakup by Country
8.5.3 Market Forecast
9    SWOT Analysis
9.1    Overview
9.2    Strengths
9.3    Weaknesses
9.4    Opportunities
9.5    Threats
10    Value Chain Analysis
11    Porters Five Forces Analysis
11.1    Overview
11.2    Bargaining Power of Buyers
11.3    Bargaining Power of Suppliers
11.4    Degree of Competition
11.5    Threat of New Entrants
11.6    Threat of Substitutes
12    Price Analysis
13    Competitive Landscape
13.1    Market Structure
13.2    Key Players
13.3    Profiles of Key Players
13.3.1    Advanced Semiconductor Engineering Inc.
13.3.1.1 Company Overview
13.3.1.2 Product Portfolio
13.3.2    Amkor Technology Inc.
13.3.2.1 Company Overview
13.3.2.2 Product Portfolio
13.3.2.3 Financials
13.3.2.4 SWOT Analysis
13.3.3    Analog Devices Inc.
13.3.3.1 Company Overview
13.3.3.2 Product Portfolio
13.3.3.3 Financials
13.3.3.4 SWOT Analysis
13.3.4    Brewer Science
13.3.4.1 Company Overview
13.3.4.2 Product Portfolio
13.3.5    ChipMOS Technologies Inc.
13.3.5.1 Company Overview
13.3.5.2 Product Portfolio
13.3.5.3 Financials
13.3.6    Microchip Technology Inc.
13.3.6.1 Company Overview
13.3.6.2 Product Portfolio
13.3.6.3 Financials
13.3.6.4 SWOT Analysis
13.3.7    Powertech Technology Inc.
13.3.7.1 Company Overview
13.3.7.2 Product Portfolio
13.3.7.3 Financials
13.3.7.4 SWOT Analysis
13.3.8    Samsung Electronics Co. Ltd
13.3.8.1 Company Overview
13.3.8.2 Product Portfolio
13.3.8.3 Financials
13.3.8.4 SWOT Analysis
13.3.9    SÜSS MicroTec SE
13.3.9.1 Company Overview
13.3.9.2 Product Portfolio
13.3.9.3 Financials
13.3.10    Taiwan Semiconductor Manufacturing Company Limited
13.3.10.1 Company Overview
13.3.10.2 Product Portfolio
13.3.10.3 Financials
13.3.10.4 SWOT Analysis
13.3.11    Texas Instruments Incorporated
13.3.11.1 Company Overview
13.3.11.2 Product Portfolio
13.3.11.3 Financials
13.3.11.4 SWOT Analysis
13.3.12    Universal Instruments Corporation (CBA Group Inc.)
13.3.12.1 Company Overview
13.3.12.2 Product Portfolio

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